Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

Pull thermal management update from Zhang Rui:
 "Highlights:

   - Introduction of thermal policy support, together with three new
     thermal governors, including step_wise, user_space, fire_share.

   - Introduction of ST-Ericsson db8500_thermal driver and ST-Ericsson
     db8500_cpufreq_cooling driver.

   - Thermal Kconfig file and Makefile refactor.

   - Fixes for generic thermal layer, generic cpucooling, rcar thermal
     driver and Exynos thermal driver."

* 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
  Thermal: Fix DEFAULT_THERMAL_GOVERNOR
  Thermal: fix a NULL pointer dereference when generic thermal layer is built as a module
  thermal: rcar: add rcar_zone_to_priv() macro
  thermal: rcar: fixup the unit of temperature
  thermal: cpu cooling: allow module builds
  thermal: cpu cooling: use const parameter while registering
  Thermal: Add ST-Ericsson DB8500 thermal properties and platform data.
  Thermal: Add ST-Ericsson DB8500 thermal driver.
  drivers/thermal/Makefile refactor
  Exynos: Add missing dependency
  Refactor drivers/thermal/Kconfig
  thermal: cpu_cooling: Make 'notify_device' static
  Thermal: Remove the cooling_cpufreq_list.
  Thermal: fix bug of counting cpu frequencies.
  Thermal: add indent for code alignment.
  thermal: rcar_thermal: remove explicitly used devm_kfree/iounap()
  thermal: user_space: Add missing static storage class specifiers
  thermal: fair_share: Add missing static storage class specifiers
  thermal: step_wise: Add missing static storage class specifiers
  Thermal: Fix oops and unlocking in thermal_sys.c
  ...

1 files changed, 44 insertions, 0 deletions

diff --git a/Documentation/devicetree/bindings/thermal/db8500-thermal.txt b/Documentation/devicetree/bindings/thermal/db8500-thermal.txt
new file mode 100644
index 0000000..2e1c06f
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/db8500-thermal.txt
@@ -0,0 +1,44 @@
+* ST-Ericsson DB8500 Thermal
+
+** Thermal node properties:
+
+- compatible : "stericsson,db8500-thermal";
+- reg : address range of the thermal sensor registers;
+- interrupts : interrupts generated from PRCMU;
+- interrupt-names : "IRQ_HOTMON_LOW" and "IRQ_HOTMON_HIGH";
+- num-trips : number of total trip points, this is required, set it 0 if none,
+  if greater than 0, the following properties must be defined;
+- tripN-temp : temperature of trip point N, should be in ascending order;
+- tripN-type : type of trip point N, should be one of "active" "passive" "hot"
+  "critical";
+- tripN-cdev-num : number of the cooling devices which can be bound to trip
+  point N, this is required if trip point N is defined, set it 0 if none,
+  otherwise the following cooling device names must be defined;
+- tripN-cdev-nameM : name of the No. M cooling device of trip point N;
+
+Usually the num-trips and tripN-*** are separated in board related dts files.
+
+Example:
+thermal@801573c0 {
+	compatible = "stericsson,db8500-thermal";
+	reg = <0x801573c0 0x40>;
+	interrupts = <21 0x4>, <22 0x4>;
+	interrupt-names = "IRQ_HOTMON_LOW", "IRQ_HOTMON_HIGH";
+
+	num-trips = <3>;
+
+	trip0-temp = <75000>;
+	trip0-type = "active";
+	trip0-cdev-num = <1>;
+	trip0-cdev-name0 = "thermal-cpufreq-0";
+
+	trip1-temp = <80000>;
+	trip1-type = "active";
+	trip1-cdev-num = <2>;
+	trip1-cdev-name0 = "thermal-cpufreq-0";
+	trip1-cdev-name1 = "thermal-fan";
+
+	trip2-temp = <85000>;
+	trip2-type = "critical";
+	trip2-cdev-num = <0>;
+}