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path: root/drivers/thermal/Makefile
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2012-09-24hwmon: exynos4: move thermal sensor driver to driver/thermal directoryAmit Daniel Kachhap
This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24thermal: add generic cpufreq cooling implementationAmit Daniel Kachhap
This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24thermal: add Renesas R-Car thermal sensor supportKuninori Morimoto
This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-03-22thermal: add support for thermal sensor present on SPEAr13xx machinesVincenzo Frascino
ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29thermal: re-name thermal.c to thermal_sys.cLen Brown
thermal_sys was already the name of the resulting module, and it is built from this one source file. Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29thermal: add the support for building the generic thermal as a moduleZhang Rui
Build the generic thermal driver as module "thermal_sys". Make ACPI thermal, video, processor and fan SELECT the generic thermal driver, as these drivers rely on it to build the sysfs I/F. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-02the generic thermal sysfs driverZhang Rui
The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>