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remove inclusion of "core.h" from all glue
layers as they don't need to know details
about the core IP.
Signed-off-by: Felipe Balbi <balbi@ti.com>
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Multiple dwc3 probe calls try to allocate no_op_xceive platform
device. Having static IDs for these will throw sysfs error -EEXIST.
Changing these static platform device IDs to AUTO to enable
multiple dwc3 controller support on a SoC.
Signed-off-by: Vivek Gautam <gautam.vivek@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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Using specific chip in compatible strings. Newer SOCs can claim
device by using older string in the compatible list.
Signed-off-by: Vivek Gautam <gautam.vivek@samsung.com>
Acked-by: Grant Likely <grant.likely@secretlab.ca>
Reviewed-by: Doug Anderson <dianders@chromium.org>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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The devm_ functions allocate memory that is released when a driver
detaches. This makes the code smaller and a bit simpler.
Signed-off-by: Jingoo Han <jg1.han@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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CONFIG_HOTPLUG is going away as an option so __devexit is no
longer needed.
Signed-off-by: Bill Pemberton <wfp5p@virginia.edu>
Cc: Peter Korsgaard <jacmet@sunsite.dk>
Cc: Alexander Shishkin <alexander.shishkin@linux.intel.com>
Acked-by: Felipe Balbi <balbi@ti.com>
Cc: Li Yang <leoli@freescale.com>
Cc: Alan Stern <stern@rowland.harvard.edu>
Cc: Wan ZongShun <mcuos.com@gmail.com>
Cc: Ben Dooks <ben-linux@fluff.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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CONFIG_HOTPLUG is going away as an option so __devinit is no longer
needed.
Signed-off-by: Bill Pemberton <wfp5p@virginia.edu>
Cc: Peter Korsgaard <jacmet@sunsite.dk>
Cc: Alexander Shishkin <alexander.shishkin@linux.intel.com>
Acked-by: Felipe Balbi <balbi@ti.com>
Cc: Li Yang <leoli@freescale.com>
Acked-by: Alan Stern <stern@rowland.harvard.edu>
Cc: Geoff Levand <geoff@infradead.org>
Cc: Wan ZongShun <mcuos.com@gmail.com>
Cc: Olav Kongas <ok@artecdesign.ee>
Cc: Lennert Buytenhek <kernel@wantstofly.org>
Cc: Ben Dooks <ben-linux@fluff.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Nicolas Ferre <nicolas.ferre@atmel.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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CONFIG_HOTPLUG is going away as an option so __devexit_p is no longer
needed.
Signed-off-by: Bill Pemberton <wfp5p@virginia.edu>
Cc: Peter Korsgaard <jacmet@sunsite.dk>
Cc: Alexander Shishkin <alexander.shishkin@linux.intel.com>
Acked-by: Felipe Balbi <balbi@ti.com>
Cc: Li Yang <leoli@freescale.com>
Cc: Alan Stern <stern@rowland.harvard.edu>
Cc: Wan ZongShun <mcuos.com@gmail.com>
Cc: Ben Dooks <ben-linux@fluff.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Nicolas Ferre <nicolas.ferre@atmel.com>
Acked-by: Peter Korsgaard <jacmet@sunsite.dk>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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We are removing plat data which was used till now to init and
exit phy. We no longer need this since dwc3-core takes care of
initializing and shutting-down the phy using usb_phy_init()
and usb_phy_shutdown().
Signed-off-by: Vivek Gautam <gautam.vivek@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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This patch adds support to parse probe data for
dwc3-exynos driver using device tree.
Signed-off-by: Vivek Gautam <gautam.vivek@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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The lockless implementation of the unique id is quite impressive (:P)
but dirver's core can handle it, we can remove it and make our code a
little smaller.
Cc: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Sebastian Andrzej Siewior <bigeasy@linutronix.de>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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We will be adding support for transceivers on
dwc3 driver but not all boards have controllable
transceivers.
For those which don't provide controllable transceivers
we will register nop transceivers.
Signed-off-by: Felipe Balbi <balbi@ti.com>
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module.h header file was included twice.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.
[ balbi@ti.com : prevent compilation of Exynos glue layer
on platforms which don't provide clk API implementation ]
Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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