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Diffstat (limited to 'include/ddr_spd.h')
| -rw-r--r-- | include/ddr_spd.h | 292 |
1 files changed, 292 insertions, 0 deletions
diff --git a/include/ddr_spd.h b/include/ddr_spd.h new file mode 100644 index 0000000..6fdcef0 --- /dev/null +++ b/include/ddr_spd.h @@ -0,0 +1,292 @@ +/* + * Copyright 2008 Freescale Semiconductor, Inc. + * + * This program is free software; you can redistribute it and/or + * modify it under the terms of the GNU General Public License + * Version 2 as published by the Free Software Foundation. + */ + +#ifndef _DDR_SPD_H_ +#define _DDR_SPD_H_ + +/* + * Format from "JEDEC Standard No. 21-C, + * Appendix D: Rev 1.0: SPD's for DDR SDRAM + */ +typedef struct ddr1_spd_eeprom_s { + unsigned char info_size; /* 0 # bytes written into serial memory */ + unsigned char chip_size; /* 1 Total # bytes of SPD memory device */ + unsigned char mem_type; /* 2 Fundamental memory type */ + unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */ + unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */ + unsigned char nrows; /* 5 Number of DIMM Banks */ + unsigned char dataw_lsb; /* 6 Data Width of this assembly */ + unsigned char dataw_msb; /* 7 ... Data Width continuation */ + unsigned char voltage; /* 8 Voltage intf std of this assembly */ + unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */ + unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */ + unsigned char config; /* 11 DIMM Configuration type */ + unsigned char refresh; /* 12 Refresh Rate/Type */ + unsigned char primw; /* 13 Primary SDRAM Width */ + unsigned char ecw; /* 14 Error Checking SDRAM width */ + unsigned char min_delay; /* 15 for Back to Back Random Address */ + unsigned char burstl; /* 16 Burst Lengths Supported */ + unsigned char nbanks; /* 17 # of Banks on SDRAM Device */ + unsigned char cas_lat; /* 18 CAS# Latencies Supported */ + unsigned char cs_lat; /* 19 CS# Latency */ + unsigned char write_lat; /* 20 Write Latency (aka Write Recovery) */ + unsigned char mod_attr; /* 21 SDRAM Module Attributes */ + unsigned char dev_attr; /* 22 SDRAM Device Attributes */ + unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-0.5 */ + unsigned char clk_access2; /* 24 SDRAM Access from + Clk @ CL=X-0.5 (tAC) */ + unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-1 */ + unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-1 (tAC) */ + unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/ + unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */ + unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */ + unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */ + unsigned char bank_dens; /* 31 Density of each bank on module */ + unsigned char ca_setup; /* 32 Addr + Cmd Setup Time Before Clk */ + unsigned char ca_hold; /* 33 Addr + Cmd Hold Time After Clk */ + unsigned char data_setup; /* 34 Data Input Setup Time Before Strobe */ + unsigned char data_hold; /* 35 Data Input Hold Time After Strobe */ + unsigned char res_36_40[5];/* 36-40 reserved for VCSDRAM */ + unsigned char trc; /* 41 Min Active to Auto refresh time tRC */ + unsigned char trfc; /* 42 Min Auto to Active period tRFC */ + unsigned char tckmax; /* 43 Max device cycle time tCKmax */ + unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */ + unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */ + unsigned char res_46; /* 46 Reserved */ + unsigned char dimm_height; /* 47 DDR SDRAM DIMM Height */ + unsigned char res_48_61[14]; /* 48-61 Reserved */ + unsigned char spd_rev; /* 62 SPD Data Revision Code */ + unsigned char cksum; /* 63 Checksum for bytes 0-62 */ + unsigned char mid[8]; /* 64-71 Mfr's JEDEC ID code per JEP-106 */ + unsigned char mloc; /* 72 Manufacturing Location */ + unsigned char mpart[18]; /* 73 Manufacturer's Part Number */ + unsigned char rev[2]; /* 91 Revision Code */ + unsigned char mdate[2]; /* 93 Manufacturing Date */ + unsigned char sernum[4]; /* 95 Assembly Serial Number */ + unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */ + +} ddr1_spd_eeprom_t; + +/* + * Format from "JEDEC Appendix X: Serial Presence Detects for DDR2 SDRAM", + * SPD Revision 1.2 + */ +typedef struct ddr2_spd_eeprom_s { + unsigned char info_size; /* 0 # bytes written into serial memory */ + unsigned char chip_size; /* 1 Total # bytes of SPD memory device */ + unsigned char mem_type; /* 2 Fundamental memory type */ + unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */ + unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */ + unsigned char mod_ranks; /* 5 Number of DIMM Ranks */ + unsigned char dataw; /* 6 Module Data Width */ + unsigned char res_7; /* 7 Reserved */ + unsigned char voltage; /* 8 Voltage intf std of this assembly */ + unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */ + unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */ + unsigned char config; /* 11 DIMM Configuration type */ + unsigned char refresh; /* 12 Refresh Rate/Type */ + unsigned char primw; /* 13 Primary SDRAM Width */ + unsigned char ecw; /* 14 Error Checking SDRAM width */ + unsigned char res_15; /* 15 Reserved */ + unsigned char burstl; /* 16 Burst Lengths Supported */ + unsigned char nbanks; /* 17 # of Banks on Each SDRAM Device */ + unsigned char cas_lat; /* 18 CAS# Latencies Supported */ + unsigned char mech_char; /* 19 DIMM Mechanical Characteristics */ + unsigned char dimm_type; /* 20 DIMM type information */ + unsigned char mod_attr; /* 21 SDRAM Module Attributes */ + unsigned char dev_attr; /* 22 SDRAM Device Attributes */ + unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-1 */ + unsigned char clk_access2; /* 24 SDRAM Access from Clk @ CL=X-1 (tAC) */ + unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-2 */ + unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-2 (tAC) */ + unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/ + unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */ + unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */ + unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */ + unsigned char rank_dens; /* 31 Density of each rank on module */ + unsigned char ca_setup; /* 32 Addr+Cmd Setup Time Before Clk (tIS) */ + unsigned char ca_hold; /* 33 Addr+Cmd Hold Time After Clk (tIH) */ + unsigned char data_setup; /* 34 Data Input Setup Time + Before Strobe (tDS) */ + unsigned char data_hold; /* 35 Data Input Hold Time + After Strobe (tDH) */ + unsigned char twr; /* 36 Write Recovery time tWR */ + unsigned char twtr; /* 37 Int write to read delay tWTR */ + unsigned char trtp; /* 38 Int read to precharge delay tRTP */ + unsigned char mem_probe; /* 39 Mem analysis probe characteristics */ + unsigned char trctrfc_ext; /* 40 Extensions to trc and trfc */ + unsigned char trc; /* 41 Min Active to Auto refresh time tRC */ + unsigned char trfc; /* 42 Min Auto to Active period tRFC */ + unsigned char tckmax; /* 43 Max device cycle time tCKmax */ + unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */ + unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */ + unsigned char pll_relock; /* 46 PLL Relock time */ + unsigned char Tcasemax; /* 47 Tcasemax */ + unsigned char psiTAdram; /* 48 Thermal Resistance of DRAM Package from + Top (Case) to Ambient (Psi T-A DRAM) */ + unsigned char dt0_mode; /* 49 DRAM Case Temperature Rise from Ambient + due to Activate-Precharge/Mode Bits + (DT0/Mode Bits) */ + unsigned char dt2n_dt2q; /* 50 DRAM Case Temperature Rise from Ambient + due to Precharge/Quiet Standby + (DT2N/DT2Q) */ + unsigned char dt2p; /* 51 DRAM Case Temperature Rise from Ambient + due to Precharge Power-Down (DT2P) */ + unsigned char dt3n; /* 52 DRAM Case Temperature Rise from Ambient + due to Active Standby (DT3N) */ + unsigned char dt3pfast; /* 53 DRAM Case Temperature Rise from Ambient + due to Active Power-Down with + Fast PDN Exit (DT3Pfast) */ + unsigned char dt3pslow; /* 54 DRAM Case Temperature Rise from Ambient + due to Active Power-Down with Slow + PDN Exit (DT3Pslow) */ + unsigned char dt4r_dt4r4w; /* 55 DRAM Case Temperature Rise from Ambient + due to Page Open Burst Read/DT4R4W + Mode Bit (DT4R/DT4R4W Mode Bit) */ + unsigned char dt5b; /* 56 DRAM Case Temperature Rise from Ambient + due to Burst Refresh (DT5B) */ + unsigned char dt7; /* 57 DRAM Case Temperature Rise from Ambient + due to Bank Interleave Reads with + Auto-Precharge (DT7) */ + unsigned char psiTApll; /* 58 Thermal Resistance of PLL Package form + Top (Case) to Ambient (Psi T-A PLL) */ + unsigned char psiTAreg; /* 59 Thermal Reisitance of Register Package + from Top (Case) to Ambient + (Psi T-A Register) */ + unsigned char dtpllactive; /* 60 PLL Case Temperature Rise from Ambient + due to PLL Active (DT PLL Active) */ + unsigned char dtregact; /* 61 Register Case Temperature Rise from + Ambient due to Register Active/Mode Bit + (DT Register Active/Mode Bit) */ + unsigned char spd_rev; /* 62 SPD Data Revision Code */ + unsigned char cksum; /* 63 Checksum for bytes 0-62 */ + unsigned char mid[8]; /* 64 Mfr's JEDEC ID code per JEP-106 */ + unsigned char mloc; /* 72 Manufacturing Location */ + unsigned char mpart[18]; /* 73 Manufacturer's Part Number */ + unsigned char rev[2]; /* 91 Revision Code */ + unsigned char mdate[2]; /* 93 Manufacturing Date */ + unsigned char sernum[4]; /* 95 Assembly Serial Number */ + unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */ + +} ddr2_spd_eeprom_t; + +typedef struct ddr3_spd_eeprom_s { + /* General Section: Bytes 0-59 */ + unsigned char info_size_crc; /* 0 # bytes written into serial memory, + CRC coverage */ + unsigned char spd_rev; /* 1 Total # bytes of SPD mem device */ + unsigned char mem_type; /* 2 Key Byte / Fundamental mem type */ + unsigned char module_type; /* 3 Key Byte / Module Type */ + unsigned char density_banks; /* 4 SDRAM Density and Banks */ + unsigned char addressing; /* 5 SDRAM Addressing */ + unsigned char res_6; /* 6 Reserved */ + unsigned char organization; /* 7 Module Organization */ + unsigned char bus_width; /* 8 Module Memory Bus Width */ + unsigned char ftb_div; /* 9 Fine Timebase (FTB) + Dividend / Divisor */ + unsigned char mtb_dividend; /* 10 Medium Timebase (MTB) Dividend */ + unsigned char mtb_divisor; /* 11 Medium Timebase (MTB) Divisor */ + unsigned char tCK_min; /* 12 SDRAM Minimum Cycle Time */ + unsigned char res_13; /* 13 Reserved */ + unsigned char caslat_lsb; /* 14 CAS Latencies Supported, + Least Significant Byte */ + unsigned char caslat_msb; /* 15 CAS Latencies Supported, + Most Significant Byte */ + unsigned char tAA_min; /* 16 Min CAS Latency Time */ + unsigned char tWR_min; /* 17 Min Write REcovery Time */ + unsigned char tRCD_min; /* 18 Min RAS# to CAS# Delay Time */ + unsigned char tRRD_min; /* 19 Min Row Active to + Row Active Delay Time */ + unsigned char tRP_min; /* 20 Min Row Precharge Delay Time */ + unsigned char tRAS_tRC_ext; /* 21 Upper Nibbles for tRAS and tRC */ + unsigned char tRAS_min_lsb; /* 22 Min Active to Precharge + Delay Time */ + unsigned char tRC_min_lsb; /* 23 Min Active to Active/Refresh + Delay Time, LSB */ + unsigned char tRFC_min_lsb; /* 24 Min Refresh Recovery Delay Time */ + unsigned char tRFC_min_msb; /* 25 Min Refresh Recovery Delay Time */ + unsigned char tWTR_min; /* 26 Min Internal Write to + Read Command Delay Time */ + unsigned char tRTP_min; /* 27 Min Internal Read to Precharge + Command Delay Time */ + unsigned char tFAW_msb; /* 28 Upper Nibble for tFAW */ + unsigned char tFAW_min; /* 29 Min Four Activate Window + Delay Time*/ + unsigned char opt_features; /* 30 SDRAM Optional Features */ + unsigned char therm_ref_opt; /* 31 SDRAM Thermal and Refresh Opts */ + unsigned char res_32_59[28]; /* 32-59 Reserved, General Section */ + + /* Module-Specific Section: Bytes 60-116 */ + union { + struct { + /* 60 (Unbuffered) Module Nominal Height */ + unsigned char mod_height; + /* 61 (Unbuffered) Module Maximum Thickness */ + unsigned char mod_thickness; + /* 62 (Unbuffered) Reference Raw Card Used */ + unsigned char ref_raw_card; + /* 63 (Unbuffered) Address Mapping from + Edge Connector to DRAM */ + unsigned char addr_mapping; + /* 64-116 (Unbuffered) Reserved */ + unsigned char res_64_116[53]; + } unbuffered; + struct { + /* 60 (Registered) Module Nominal Height */ + unsigned char mod_height; + /* 61 (Registered) Module Maximum Thickness */ + unsigned char mod_thickness; + /* 62 (Registered) Reference Raw Card Used */ + unsigned char ref_raw_card; + } registered; + unsigned char uc[57]; /* 60-116 Module-Specific Section */ + } mod_section; + + /* Unique Module ID: Bytes 117-125 */ + unsigned char mmid_lsb; /* 117 Module MfgID Code LSB - JEP-106 */ + unsigned char mmid_msb; /* 118 Module MfgID Code MSB - JEP-106 */ + unsigned char mloc; /* 119 Mfg Location */ + unsigned char mdate[2]; /* 120-121 Mfg Date */ + unsigned char sernum[4]; /* 122-125 Module Serial Number */ + + /* CRC: Bytes 126-127 */ + unsigned char crc[2]; /* 126-127 SPD CRC */ + + /* Other Manufacturer Fields and User Space: Bytes 128-255 */ + unsigned char mpart[18]; /* 128-145 Mfg's Module Part Number */ + unsigned char mrev[2]; /* 146-147 Module Revision Code */ + + unsigned char dmid_lsb; /* 148 DRAM MfgID Code LSB - JEP-106 */ + unsigned char dmid_msb; /* 149 DRAM MfgID Code MSB - JEP-106 */ + + unsigned char msd[26]; /* 150-175 Mfg's Specific Data */ + unsigned char cust[80]; /* 176-255 Open for Customer Use */ + +} ddr3_spd_eeprom_t; + +extern unsigned int ddr1_spd_check(const ddr1_spd_eeprom_t *spd); +extern void ddr1_spd_dump(const ddr1_spd_eeprom_t *spd); +extern unsigned int ddr2_spd_check(const ddr2_spd_eeprom_t *spd); +extern void ddr2_spd_dump(const ddr2_spd_eeprom_t *spd); + +/* + * Byte 2 Fundamental Memory Types. + */ +#define SPD_MEMTYPE_FPM (0x01) +#define SPD_MEMTYPE_EDO (0x02) +#define SPD_MEMTYPE_PIPE_NIBBLE (0x03) +#define SPD_MEMTYPE_SDRAM (0x04) +#define SPD_MEMTYPE_ROM (0x05) +#define SPD_MEMTYPE_SGRAM (0x06) +#define SPD_MEMTYPE_DDR (0x07) +#define SPD_MEMTYPE_DDR2 (0x08) +#define SPD_MEMTYPE_DDR2_FBDIMM (0x09) +#define SPD_MEMTYPE_DDR2_FBDIMM_PROBE (0x0A) +#define SPD_MEMTYPE_DDR3 (0x0B) + +#endif /* _DDR_SPD_H_ */ |