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author | Durgadoss R <dugardoss.r@intel.com> | 2012-07-25 02:10:58 (GMT) |
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committer | Len Brown <len.brown@intel.com> | 2012-07-25 03:17:20 (GMT) |
commit | c56f5c0342dfee11a1a13d2f5bb7618de5b17590 (patch) | |
tree | 4f5bae9424271e41d10d0c9d9fc17be6f63fba63 /Documentation/thermal/sysfs-api.txt | |
parent | 28a33cbc24e4256c143dce96c7d93bf423229f92 (diff) | |
download | linux-c56f5c0342dfee11a1a13d2f5bb7618de5b17590.tar.xz |
Thermal: Make Thermal trip points writeable
Some of the thermal drivers using the Generic Thermal Framework
require (all/some) trip points to be writeable. This patch makes
the trip point temperatures writeable on a per-trip point basis,
and modifies the required function call in thermal.c. This patch
also updates the Documentation to reflect the new change.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Diffstat (limited to 'Documentation/thermal/sysfs-api.txt')
-rw-r--r-- | Documentation/thermal/sysfs-api.txt | 4 |
1 files changed, 3 insertions, 1 deletions
diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt index 1733ab9..4c10593 100644 --- a/Documentation/thermal/sysfs-api.txt +++ b/Documentation/thermal/sysfs-api.txt @@ -32,7 +32,8 @@ temperature) and throttle appropriate devices. 1.1 thermal zone device interface 1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name, - int trips, void *devdata, struct thermal_zone_device_ops *ops) + int trips, int mask, void *devdata, + struct thermal_zone_device_ops *ops) This interface function adds a new thermal zone device (sensor) to /sys/class/thermal folder as thermal_zone[0-*]. It tries to bind all the @@ -40,6 +41,7 @@ temperature) and throttle appropriate devices. name: the thermal zone name. trips: the total number of trip points this thermal zone supports. + mask: Bit string: If 'n'th bit is set, then trip point 'n' is writeable. devdata: device private data ops: thermal zone device call-backs. .bind: bind the thermal zone device with a thermal cooling device. |