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path: root/drivers/thermal/Kconfig
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2013-02-08Thermal: rename thermal governor Kconfig option to avoid generic namingZhang Rui
Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08Thermal: Dove: Add Themal sensor support for Dove.Andrew Lunn
The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08thermal: Add support for the thermal sensor on Kirkwood SoCsNobuhiro Iwamatsu
This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06thermal: sysfs: Add a new sysfs node emul_temp for thermal emulationAmit Daniel Kachhap
This patch adds support to set the emulated temperature method in thermal zone (sensor). After setting this feature thermal zone may report this temperature and not the actual temperature. The emulation implementation may be based on sensor capability through platform specific handler or pure software emulation if no platform handler defined. This is useful in debugging different temperature threshold and its associated cooling action. Critical threshold's cannot be emulated. Writing 0 on this node should disable emulation. Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06PM: Introduce Intel PowerClamp DriverJacob Pan
Intel PowerClamp driver performs synchronized idle injection across all online CPUs. The goal is to maintain a given package level C-state ratio. Compared to other throttling methods already exist in the kernel, such as ACPI PAD (taking CPUs offline) and clock modulation, this is often more efficient in terms of performance per watt. Please refer to Documentation/thermal/intel_powerclamp.txt for more details. Signed-off-by: Arjan van de Ven <arjan@linux.intel.com> Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-04Thermal: exynos: Add sysfs node supporting exynos's emulation mode.Jonghwa Lee
This patch supports exynos's emulation mode with newly created sysfs node. Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal management unit. Thermal emulation mode supports software debug for TMU's operation. User can set temperature manually with software code and TMU will read current temperature from user value not from sensor's value. This patch includes also documentary placed under Documentation/thermal/. Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-12-13Merge branch 'for-linus' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial Pull trivial branch from Jiri Kosina: "Usual stuff -- comment/printk typo fixes, documentation updates, dead code elimination." * 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial: (39 commits) HOWTO: fix double words typo x86 mtrr: fix comment typo in mtrr_bp_init propagate name change to comments in kernel source doc: Update the name of profiling based on sysfs treewide: Fix typos in various drivers treewide: Fix typos in various Kconfig wireless: mwifiex: Fix typo in wireless/mwifiex driver messages: i2o: Fix typo in messages/i2o scripts/kernel-doc: check that non-void fcts describe their return value Kernel-doc: Convention: Use a "Return" section to describe return values radeon: Fix typo and copy/paste error in comments doc: Remove unnecessary declarations from Documentation/accounting/getdelays.c various: Fix spelling of "asynchronous" in comments. Fix misspellings of "whether" in comments. eisa: Fix spelling of "asynchronous". various: Fix spelling of "registered" in comments. doc: fix quite a few typos within Documentation target: iscsi: fix comment typos in target/iscsi drivers treewide: fix typo of "suport" in various comments and Kconfig treewide: fix typo of "suppport" in various comments ...
2012-12-03treewide: Fix typos in various KconfigMasanari Iida
Correct spelling typo within various Kconfig. Signed-off-by: Masanari Iida <standby24x7@gmail.com> Signed-off-by: Jiri Kosina <jkosina@suse.cz>
2012-11-22thermal: cpu cooling: allow module buildsEduardo Valentin
As thermal drivers can be built as modules and also the thermal framework itself, building cpu cooling only as built-in can cause linking errors. For instance: * Generic Thermal sysfs driver * Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y with the following drive: CONFIG_OMAP_BANDGAP=m generates: ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined! ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined! This patch changes cpu cooling driver to allow it to be built as module. Reported-by: Enric Balletbo i Serra <eballetbo@gmail.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Reviewed-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15Thermal: Add ST-Ericsson DB8500 thermal driver.hongbo.zhang
This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15Exynos: Add missing dependencyZhang Rui
CPU_FREQ_TABLE depends on CPU_FREQ. Selecting CPU_FREQ_TABLE without checking for dependencies gives the following compilation warnings: warning: (ARCH_TEGRA_2x_SOC && ARCH_TEGRA_3x_SOC && UX500_SOC_DB8500 && CPU_THERMAL && EXYNOS_THERMAL) selects CPU_FREQ_TABLE which has unmet direct dependencies (ARCH_HAS_CPUFREQ && CPU_FREQ) Based-on-patch-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15Refactor drivers/thermal/KconfigZhang Rui
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Provide option to choose default thermal governorDurgadoss R
This patch provides option to choose the default thermal governor. If no option is provided, the step_wise governor is selected by default. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Add a thermal notifier for user spaceDurgadoss R
This patch registers a governor which will let the user land manage the platform thermals. Whenever a trip happens, this governor just notifies the user space using kobj_uevent(). Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Introduce a step_wise thermal governorDurgadoss R
This patch adds a simple step_wise governor to the generic thermal layer. This algorithm throttles the cooling devices in a linear fashion. If the 'trend' is heating, it throttles by one step. And if the thermal trend is cooling it de-throttles by one step. This actually moves the throttling logic from thermal_sys.c and puts inside step_wise.c, without any change. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Introduce fair_share thermal governorDurgadoss R
This patch introduces a simple 'weight' based governor named fair_share governor. Whenever the thermal framework gets notified of the trip point violation, this governor (if configured), throttles the cooling devices associated with a thermal zone. This mapping between a thermal zone and a cooling device and the effectiveness of cooling are provided in the platform layer. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-10-15thermal, cpufreq: Fix build when CPU_FREQ_TABLE isn't configuredDavid Rientjes
Commit 023614183768 ("thermal: add generic cpufreq cooling implementation") requires cpufreq_frequency_get_table(), but that function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the following build error: drivers/built-in.o: In function `cpufreq_get_max_state': drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table' drivers/built-in.o: In function `get_cpu_frequency': drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table' Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration. It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so select it there as well. Signed-off-by: David Rientjes <rientjes@google.com> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2012-09-24thermal: exynos5: add exynos5250 thermal sensor driver supportAmit Daniel Kachhap
Insert exynos5 TMU sensor changes into the thermal driver. Some exynos4 changes are made generic for exynos series. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: SangWook Ju <sw.ju@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24hwmon: exynos4: move thermal sensor driver to driver/thermal directoryAmit Daniel Kachhap
This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24thermal: add generic cpufreq cooling implementationAmit Daniel Kachhap
This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24thermal: add Renesas R-Car thermal sensor supportKuninori Morimoto
This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-06-02drivers/thermal/spear_thermal.c: add Device Tree probing capabilityViresh Kumar
SPEAr platforms now support DT and so must convert all drivers to support DT. This patch adds DT probing support for SPEAr thermal sensor driver and updates its documentation too. Also, as SPEAr is the only user of this driver and is only available with DT, make this an only DT driver. So, platform_data is completely removed and passed via DT now. Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22thermal: add support for thermal sensor present on SPEAr13xx machinesVincenzo Frascino
ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2011-08-02thermal: hide CONFIG_THERMAL_HWMONJean Delvare
It's about time to revert 16d752397301b9 ("thermal: Create CONFIG_THERMAL_HWMON=n"). Anybody running a kernel >= 2.6.40 would also be running a recent enough version of lm-sensors. Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of dropping it, we keep it but hide it. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2011-03-01ACPI: Fix build for CONFIG_NET unsetRafael J. Wysocki
Several ACPI drivers fail to build if CONFIG_NET is unset, because they refer to things depending on CONFIG_THERMAL that in turn depends on CONFIG_NET. However, CONFIG_THERMAL doesn't really need to depend on CONFIG_NET, because the only part of it requiring CONFIG_NET is the netlink interface in thermal_sys.c. Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET and remove the dependency of CONFIG_THERMAL on CONFIG_NET from drivers/thermal/Kconfig. Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl> Acked-by: Randy Dunlap <randy.dunlap@oracle.com> Cc: Ingo Molnar <mingo@elte.hu> Cc: Len Brown <lenb@kernel.org> Cc: Stephen Rothwell <sfr@canb.auug.org.au> Cc: Luming Yu <luming.yu@intel.com> Cc: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2011-01-12thermal: Add event notification to thermal frameworkR.Durgadoss
This patch adds event notification support to the generic thermal sysfs framework in the kernel. The notification is in the form of a netlink event. Signed-off-by: R.Durgadoss <durgadoss.r@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2009-09-19thermal: add missing Kconfig dependencyJan Beulich
Otherwise THERMAL_HWMON can be selected when HWMON=n and THERMAL=n, which fails to build. Signed-off-by: Jan Beulich <jbeulich@novell.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Matthew Garrett <mjg@redhat.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-25thermal: Create CONFIG_THERMAL_HWMON=nRene Herman
A bug in libsensors <= 2.10.6 is exposed when this new hwmon I/F is enabled. Create CONFIG_THERMAL_HWMON=n until some time after libsensors 2.10.7 ships so those users can run the latest kernel. libsensors 3.x is already fixed -- those users can use CONFIG_THERMAL_HWMON=y now. Signed-off-by: Rene Herman <rene.herman@gmail.com> Acked-by: Mark M. Hoffman <mhoffman@lightlink.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29thermal: add the support for building the generic thermal as a moduleZhang Rui
Build the generic thermal driver as module "thermal_sys". Make ACPI thermal, video, processor and fan SELECT the generic thermal driver, as these drivers rely on it to build the sysfs I/F. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-03-18thermal: delete "default y"Len Brown
The generic thermal I/F gets selected by ACPI_THERMAL -- its only current customer. it doesn't need to clutter other configs by default. Signed-off-by: Len Brown <len.brown@intel.com>
2008-03-18Revert "thermal: fix generic thermal I/F for hwmon"Len Brown
This reverts commit 3152fb9f11cdd2fd8688c2c5cb805e5c09b53dd9. This broke libsensors. Acked-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-03-13thermal: fix generic thermal I/F for hwmonZhang, Rui
Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-08ACPI: thermal: syntax, spelling, kernel-docLen Brown
Reviewed-by: Randy Dunlap <randy.dunlap@oracle.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-02the generic thermal sysfs driverZhang Rui
The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>