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The declarations should not be in common.h. Move them to the arch-specific
headers.
Signed-off-by: Simon Glass <sjg@chromium.org>
[trini: Fixup thinko defined(FSL_LSCH3) -> defined(CONFIG_FSL_LSCH3)]
Signed-off-by: Tom Rini <trini@konsulko.com>
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Commit 088454cd dropped return value from initram(), setting
gd->ram_size directly. Three boards were missed for SPL boot.
Signed-off-by: York Sun <york.sun@nxp.com>
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This function name shadows a global name but is in fact different. This
is very confusing. Rename it to help with the following refactoring.
Signed-off-by: Simon Glass <sjg@chromium.org>
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At present we cannot use this function as an init sequence call without a
wrapper, since it returns the RAM size. Adjust it to set the RAM size in
global_data instead, and return 0 on success.
Signed-off-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Stefan Roese <sr@denx.de>
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It looks like only cm5200 and tqm8xx use this feature, so we don't really
need it in generic code. Drop it and have the users access gd->board_type
directly.
Signed-off-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Stefan Roese <sr@denx.de>
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For ARMv8 Layerscape SoCs, secure memory and MC memorey are reserved
at the end of DDR. DDR is spit into two or three banks. This patch
reverts commit aabd7ddb and simplifies the calculation of reserved
memory, and moves the code into common SoC file. Secure memory is
carved out first. DDR bank size is reduced. Reserved memory is then
allocated on the top of available memory. U-Boot still has access
to reserved memory as data transferring is needed. Device tree is
fixed with reduced memory size to hide the reserved memory from OS.
The same region is reserved for efi_loader.
Signed-off-by: York Sun <york.sun@nxp.com>
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Optimize board-specific cpo for erratum A-009942 on b4860qds,
ls1043aqds, ls1043ardb, ls1046aqds, ls1046ardb, ls2080ardb,
t102xqds, t102xrdb, t1040qds, t104xrdb, t208xqds, t208xrdb,
t4qds, t4rdb boards.
Signed-off-by: Shengzhou Liu <Shengzhou.Liu@nxp.com>
Reviewed-by: York Sun <york.sun@nxp.com>
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LS1046AQDS Specification:
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Memory subsystem:
* 8GByte DDR4 SDRAM (64bit bus)
* 128 Mbyte NOR flash single-chip memory
* 512 Mbyte NAND flash
* 64 Mbyte high-speed SPI flash
* SD connector to interface with the SD memory card
Ethernet:
* Two XFI 10G ports
* Two SGMII ports
* Two RGMII ports
PCIe: supports Gen 1 and Gen 2
SATA 3.0: one SATA 3.0 port
USB 3.0: two micro AB connector and one type A connector
UART: supports two UARTs up to 115200 bps for console
Signed-off-by: Shaohui Xie <Shaohui.Xie@nxp.com>
Signed-off-by: Mingkai Hu <mingkai.hu@nxp.com>
Signed-off-by: Gong Qianyu <Qianyu.Gong@nxp.com>
Reviewed-by: York Sun <york.sun@nxp.com>
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