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This commit adjusts some files to use Kbuild.include.
- Use cc-option defined in Kbuild.include
(Delete cc-option in config.mk)
- Use cc-version defined in
(Delete cc-version in config.mk)
- Move binutils-version and dtc-version to Kbuild.include
by analogy to cc-version
This commit also adds srctree (same as SRCTREE)
to use Kbuild scripts.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Some Samsung boards have their own tools under board/samsung/<board>/tools/.
This commit refactor more makefiles with "hostprogs-y".
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Before this commit, makefiles under tools/ directory
were implemented with their own way.
This commit refactors them by using "hostprogs-y" variable.
Several C sources have been added to wrap other C sources
to simplify Makefile.
For example, tools/crc32.c includes lib/crc32.c
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Add spl_sata to read a fat partition from a bootable SATA
drive.
Signed-off-by: Dan Murphy <dmurphy@ti.com>
Reviewed-by: Roger Quadros <rogerq@ti.com>
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Add SPL support to be able to detect a USB Mass Storage device
connected to a USB host. Once a USB Mass storage device is detected
the SPL will load the u-boot.img from a FAT partition to target address.
Signed-off-by: Dan Murphy <dmurphy@ti.com>
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Using the TPL method for nand boot by sram was already
supported. Here add some code for mpc85xx ifc nand boot.
- For ifc, elbc, esdhc, espi, all need the SPL without
section .resetvec.
- Use a clear function name for nand spl boot.
- Add CONFIG_SPL_DRIVERS_MISC_SUPPORT to compile the fsl_ifc.c
in spl/Makefile;
Signed-off-by: Po Liu <Po.Liu@freescale.com>
Acked-by: Scott Wood <scottwood@freescale.com>
Reviewed-by: York Sun <yorksun@freescale.com>
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Some targets will build fine but not boot if sections .hash and
.got.plt are not present in the binary. Add them back.
Also, Exynos machines require .machine_param section in SPL.
Add it.
Signed-off-by: Albert ARIBAUD <albert.u.boot@aribaud.net>
Tested-by: Rajeshwari S Shinde <rajeshwari.s@samsung.com>
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Bringing in the MMC tree means that CONFIG_BOUNCE_BUFFER needed to be
added to include/configs/exynos5-dt.h now.
Conflicts:
include/configs/exynos5250-dt.h
Signed-off-by: Tom Rini <trini@ti.com>
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When variable size SPL is used, the BL1 expects the SPL to be
encapsulated differently: instead of putting the checksum at a fixed
offset in the SPL blob, prepend the blob with a header including the
size and the checksum.
The enhancements include
- adding a command line option, '--vs' to indicate the need for the
variable size encapsulation
- padding the fixed size encapsulated blob with 0xff instead of random
memory contents
- do not silently truncate the input file, report error instead
- no need to explicitly closing files/freeing memory, this all happens
on exit; removing cleanups it makes code clearer
- profuse commenting
- modify Makefile to allow enabling the new feature per board
Signed-off-by: Vadim Bendebury <vbendeb@chromium.org>
Signed-off-by: Rajeshwari S Shinde <rajeshwari.s@samsung.com>
Acked-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Minkyu Kang <mk7.kang@samsung.com>
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Convert like follows:
CPU mpc83xx -> CONFIG_MPC83xx
CPU mpc85xx -> CONFIG_MPC85xx
CPU mpc86xx -> CONFIG_MPC86xx
CPU mpc5xxx -> CONFIG_MPC5xxx
CPU mpc8xx -> CONFIG_8xx
CPU mpc8260 -> CONFIG_8260
CPU ppc4xx -> CONFIG_4xx
CPU x86 -> CONFIG_X86
ARCH x86 -> CONFIG_X86
ARCH powerpc -> CONFIG_PPC
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Before this commit, output files under tpl/ directry
were not ignored.
This commit fixes this problem.
And we have only one source file under spl/ directory:
spl/Makefile
So, we can describe .gitignore more simply.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Some editors such as Emacs can highlight source files.
But their parser algorithm is not perfect.
If you use one double-quotation alone, some editor cannot
handle it nicely and mark source lines as a string by mistake.
It is preferable to use two double-quotations as a pair.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Freescale DDR driver has been used for mpc83xx, mpc85xx, mpc86xx SoCs.
The similar DDR controllers will be used for ARM-based SoCs.
Signed-off-by: York Sun <yorksun@freescale.com>
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Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Cc: Simon Glass <sjg@chromium.org>
Acked-by: Simon Glass <sjg@chromium.org>
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Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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We have converted all makefiles needed to build $(LIBS).
Until this commit we used to grep switch so that U-Boot style
and Kbuild style makefiles coexist.
But we do not need any more.
Goint forward, use always Kbuild style Makefile when adding
a new Makefile
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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This patch moves S5PC, EXYNOS specific directory entries
from the toplevel Makefile to arch/arm/cpu/armv7/Makefile
using Kbuild descending feature.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Cc: Minkyu Kang <mk7.kang@samsung.com>
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This patch moves OMAP specific directory entries
from the toplevel Makefile and spl/Makefile
to arch/arm/cpu/armv7/Makefile using Kbuild descending feature.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Cc: Tom Rini <trini@ti.com>
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This patch moves Tegra specific directory entries
from the toplevel Makefile and spl/Makefile
to arch/arm/cpu/*/Makefile using Kbuild descending feature.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Cc: Tom Warren <TWarren@nvidia.com>
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Multiple targets are included in arch/arm/imx-common/Makefile
In order to refactor it,
we need to tweak Makefile and spl/Makefile.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
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Every makefile in sub directories has common lines
at the top and the bottom.
This commit pushes the common parts into script/Makefile.build.
Going forward sub-makefiles only need to describe this part:
COBJS := ...
COBJS += ...
SOBJS := ...
But using obj-y is preferable to prepare for switching to Kbuild.
The conventional (non-Kbuild) Makefile style is still supported.
This is achieved by greping the Makefile before entering into it.
U-Boot conventional sub makefiles always include some other makefiles.
So the build system searches a line beginning with "include" keyword
in the makefile in order to distinguish which style it is.
If the Makefile include a "include" line, we assume it is a conventional
U-Boot style. Otherwise, it is treated as a Kbuild-style makefile.
With this tweak, we can switch sub-makefiles
from U-Boot style to Kbuild style little by little.
obj-y := foo/
syntax (descending into the sub directory) is not supportd yet.
It will be implemented in the upcomming commit.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Cc: Simon Glass <sjg@chromium.org>
Cc: Tom Rini <trini@ti.com>
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We may need to access the PMIC code in SPL, when we have power set.
Signed-off-by: Tom Rini <trini@ti.com>
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Signed-off-by: Heiko Schocher <hs@denx.de>
Cc: Tom Rini <trini@ti.com>
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Due to the nand SPL on some board(e.g. P1022DS)has a size limit, it can
not be more than 4K. So, the SPL cannot initialize the DDR with the SPD
code. This patch introduces TPL to enable a loader stub that is loaded
by the code from the SPL. It initializes the DDR with the SPD or other
operations.
The TPL's size is sizeable, the maximum size is decided by the memory's
size that TPL runs. It initializes the DDR through SPD code, and copys
final uboot image to DDR. So there are three stage uboot images:
* spl_boot, * tpl_boot, * final uboot image
Signed-off-by: Ying Zhang <b40530@freescale.com>
Acked-by: York Sun <yorksun@freescale.com>
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The code from the internal on-chip ROM. It loads the final uboot image
into DDR, then jump to it to begin execution.
The SPL's size is sizeable, the maximum size must not exceed the size of L2
SRAM. It initializes the DDR through SPD code, and copys final uboot image
to DDR. So there are two stage uboot images:
* spl_boot, 96KB size. The env variables are copied to L2 SRAM, so that
ddr spd code can get the interleaving mode setting in env. It loads
final uboot image from offset 96KB.
* final uboot image, size is variable depends on the functions enabled.
Signed-off-by: Ying Zhang <b40530@freescale.com>
Acked-by: York Sun <yorksun@freescale.com>
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SPL defines CONFIG_SPL_BUILD but this does not percolate to the
autoconf.mk Makefile. As a result the build breaks when
CONFIG_SPL_BUILD is used in the board-specific include header file. With
this, there is a possibility of having a CONFIG option defined in the
header file but not defined in the Makefile causing all kinds of build
failure and problems.
It also messes things for up, for example, when one might want to
undefine options to keep the SPL small and doesn't want to be stuck with
the CONFIG options used for U-boot. Lastly, this also avoids defining
special CONFIG_SPL_ variables for cases where some options are required
in U-boot but not in SPL.
We add a spl-autoconf.mk rule that is generated for SPL with the
CONFIG_SPL_BUILD flag and conditionally include it for SPL builds.
Signed-off-by: Joel Fernandes <joelf@ti.com>
Signed-off-by: Ying Zhang <b40530@freescale.com>
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Adding a new CONFIG_OMAP_COMMON which is included by all boards
that needs to build cpu/armv7/omap-common folder.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
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Signed-off-by: Wolfgang Denk <wd@denx.de>
[trini: Fixup common/cmd_io.c]
Signed-off-by: Tom Rini <trini@ti.com>
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Conflicts:
spl/Makefile
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This requires that cpu_is_exynos4/5 should be made available before tzpc_init.
Hence this patch also makes necessary changes to have cpu_info in spl and
invokes arch_cpu_init before tzpc_init in low_level_init.S for smdk5250.
Signed-off-by: Inderpal Singh <inderpal.singh@linaro.org>
Acked-by: Chander Kashyap <chander.kashyap@linaro.org>
Signed-off-by: Minkyu Kang <mk7.kang@samsung.com>
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Signed-off-by: Benoît Thébaudeau <benoit.thebaudeau@advansee.com>
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Allow usage of the imx-common/iomux-v3.h framework by including pad settings for
the i.MX35. The content of the file is taken from Linux kernel at commit
267dd34, plus the required changes to make it work in U-Boot.
Signed-off-by: Benoît Thébaudeau <benoit.thebaudeau@advansee.com>
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Fix minor adjustments needed to get SPL framework building on MX5.
Signed-off-by: Marek Vasut <marex@denx.de>
Cc: Albert ARIBAUD <albert.u.boot@aribaud.net>
Cc: Benoît Thébaudeau <benoit.thebaudeau@advansee.com>
Cc: Fabio Estevam <fabio.estevam@freescale.com>
Cc: Scott Wood <scottwood@freescale.com>
Cc: Stefano Babic <sbabic@denx.de>
Cc: Tom Rini <trini@ti.com>
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This patch moves the following functions into the imx-common
directory:
- mxs_wait_mask_set()
- mxs_wait_mask_clr()
- mxs_reset_block()
These are currently used by i.MX28. But the upcoming GPMI NAND port
for i.MX6 will also use these functions. So lets move them to a
common location to re-use them.
Signed-off-by: Stefan Roese <sr@denx.de>
Cc: Stefano Babic <sbabic@denx.de>
Cc: Marek Vasut <marex@denx.de>
Cc: Fabio Estevam <fabio.estevam@freescale.com>
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Add TI814X EVM board directory, config file, and MAINTAINERS
entry. Enable build.
Signed-off-by: Matt Porter <mporter@ti.com>
Reviewed-by: Tom Rini <trini@ti.com>
[trini: Adapt to recent omap_hsmmc requirements, Matt re-tested]
Signed-off-by: Tom Rini <trini@ti.com>
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Refactor linker-generated array code so that symbols
which were previously linker-generated are now compiler-
generated. This causes relocation records of type
R_ARM_ABS32 to become R_ARM_RELATIVE, which makes
code which uses LGA able to run before relocation as
well as after.
Note: this affects more than ARM targets, as linker-
lists span possibly all target architectures, notably
PowerPC.
Conflicts:
arch/arm/cpu/arm926ejs/mxs/u-boot-spl.lds
arch/arm/cpu/arm926ejs/spear/u-boot-spl.lds
arch/arm/cpu/armv7/omap-common/u-boot-spl.lds
board/ait/cam_enc_4xx/u-boot-spl.lds
board/davinci/da8xxevm/u-boot-spl-da850evm.lds
board/davinci/da8xxevm/u-boot-spl-hawk.lds
board/vpac270/u-boot-spl.lds
Signed-off-by: Albert ARIBAUD <albert.u.boot@aribaud.net>
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Many SPL linker scripts needlessly include linker lists (aka LGAs).
Remove them whenever possible; keep it only in the seven am335x_evm
variants (am335x_evm, am335x_evm_uart[1-5], am335x_evm_spiboot),
where there is actual content in output section .u_boot_list.
This commit keeps all u-boot.bin and u-boot-spl.bin in ARM targets
byte-identical.
Signed-off-by: Albert ARIBAUD <albert.u.boot@aribaud.net>
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In case of usbeth booting just call net_load_image("usb_ether").
This patch also adds CONFIG_SPL_USBETH_SUPPORT and
CONFIG_SPL_MUSB_NEW_SUPPORT config options to enable linking of SPL
against USB gagdet support and new MUSB driver resp.
Signed-off-by: Ilya Yanok <ilya.yanok@cogentembedded.com>
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The '#' used as comments in the files cause the preprocessor
trouble, so change to /* */.
The mkimage command which uses this preprocessor output
was moved to arch/arm/imx-common/Makefile
.gitignore was updated to ignore .cfgtmp files.
Signed-off-by: Troy Kisky <troy.kisky@boundarydevices.com>
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This patch adds basic Tegra30 (T30) build support - no specific
board is targeted.
Signed-off-by: Tom Warren <twarren@nvidia.com>
Reviewed-by: Stephen Warren <swarren@nvidia.com>
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Conflicts:
README
board/samsung/universal_c210/universal.c
drivers/misc/Makefile
drivers/power/power_fsl.c
include/configs/mx35pdk.h
include/configs/mx53loco.h
include/configs/seaboard.h
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The toplevel makefile hardcodes this stuff, so spl/Makefile needs to as well.
Signed-off-by: Scott Wood <scottwood@freescale.com>
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Signed-off-by: Stefano Babic <sbabic@denx.de>
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